Kuo: iPhone 15 Pro Overheating Issues Likely Due to Thermal Compromises, Not 3nm Node

iPhone 15 Pro Overheating Issues Likely Stem from Thermal Design Compromises, Not 3nm Node

Complaints about overheating problems in the iPhone 15 Pro models are likely not related to the use of TSMC’s 3-nanometer node for the A17 Pro chip, according to the well-regarded Apple analyst, Ming-Chi Kuo.

Kuo suggests that the overheating concerns could be attributed to “compromises made in the thermal system design,” which allowed Apple to reduce the weight of the iPhone 15 Pro models. These compromises include a reduction in the heat dissipation area and the incorporation of a titanium frame, both of which have had a detrimental effect on the devices’ thermal efficiency.

Apple is anticipated to address these thermal issues through software updates, but the extent of improvements may be limited unless Apple decides to decrease processor performance. Kuo believes that if Apple is unable to effectively resolve this issue, it could potentially impact shipments throughout the lifespan of the iPhone 15 Pro.

Reports have emerged about the iPhone 15 Pro models becoming excessively hot to the touch, and certain tests have indicated that, in such situations, the processor is throttled to cool the iPhone down. It’s worth noting that these tests are often benchmarks and extreme use cases, which may not necessarily affect day-to-day users. However, it remains to be seen how the iPhone 15 Pro models will perform with console-quality games like Resident Evil Village and Death Stranding.


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